PassPort 2
Passport machine for laminating of covers and/or chip-inlays
The PassPort 2 machine laminates covers and/or chip-inlays onto layers sewn by PassPort 1.
All passport machines by Kugler-Womako adhere to the strict quality guidelines of the ICAO and ISO for “Machine Readable Passports (MRP) and electronic passports.”
The passport machine PassPort 2 can be combined with the following Kugler-Womako machines:
- PassPort 1 Collating, Sewing
- PassPort 3 Embossing, Folding, Die cutting
- PassPort 4 Numbering+Chip programming
- Feeder for sewn layers
- Seam gluing with cold glue
- Feeding of cover material and/or chip-inlays
- Laminating of cover material or chip-inlays
- Pressing of layers
- Delivery
- Seam gluing with UV curable glue
- Secondary feeding and secondary lamination station for additional lamination of chip-inlays, to get chip-inlay and cover onto sewn layer in one working step
- Pile press
- Chip verification with automatic rejection of defective chip-inlays (without interruption of the production process), marking rejects by labeling
- Registration of Chip-UIDs used
- Inline connection to PassPort 1 and PassPort 3
